Accelerator for curing epoxy and polyurethane systems.

• 2. Application areas

   

  • Epoxy resin curing acceleration:
    • In epoxy resin systems, DMP-30 is widely used as a curing accelerator. It can significantly speed up the reaction between epoxy resins and various curing agents such as acid anhydrides, dicyandiamide, and phenolic resins. For example, in the production of epoxy coatings, adhesives, and casting resins, adding an appropriate amount of DMP-30 can reduce the curing time and lower the curing temperature, which is beneficial for improving production efficiency and reducing energy consumption.
    • In the case of epoxy-acid anhydride curing systems, DMP-30 can catalyze the reaction between the epoxy groups of the epoxy resin and the carboxyl groups of the acid anhydride, promoting the formation of a cross-linked network structure.
  • Composite materials:
    • When preparing epoxy-based composite materials (such as glass fiber-reinforced composites, carbon fiber-reinforced composites), DMP-30 can be used to adjust the curing process. It helps to ensure that the epoxy resin matrix cures uniformly and quickly around the reinforcing fibers, enhancing the mechanical properties of the composite materials, such as strength and toughness.
  • Electrical insulation materials:
    • In the production of electrical insulation products like electrical insulators, transformer insulation components, and electrical encapsulants made of epoxy resin, DMP-30 plays an important role in accelerating the curing process. This ensures that the final products have good electrical insulation properties and mechanical stability.
  • Adhesive applications:
    • Epoxy adhesives are widely used in various industries for bonding different materials. DMP-30 can be added to epoxy adhesive formulations to make the adhesive cure faster, which is useful in applications where quick bonding is required, such as in the automotive and aerospace industries for bonding metal parts, composites, and other components.
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